Ukukhuthaza kunye nemiceli mngeni ye-chip ye-chip
Ekuqaleni kwe-semiconductor entsha, itekhnoloji yokuqesha ivela.Ibhulorho ye-Heterogenenetion Inkampani yokudibanisa - iinkampani zokuqhagamshela ezine-semiconductors.I-Chip Asundus, ekwakhelwe kwiindawo ezahlukeneyo, ibaluleke kakhulu.Baqhuba inkqubela phambili kwezobuchwephesha, ukulungisa i-china ukuya kuthi ga kwinqanaba elibalulekileyo lokuphuhliswa kweNkqubo ye-AI yasekhaya.Ezi prosesa zinokubangela ukuba iinkampani zaseNtshona, okwangoku zibandakanyeke kwimithi yokuthumela kwelinye ilizwe.
Nangona kunjalo, indlela ye-Nettivation ayinasimahla kwimirhubhe.I-Stanchel Afisi Zels iphosile isithunzi.ISebe leMfundo le-U.S.Bacacisa amanyathelo amatsha.Izixhobo eziphambili zekhompyuter kunye nezixhobo zokwenza i-semicondcuctore zenziwe phantsi.I-chip isurika, ngelixa ingaqaqanjiswa ngokubanzi kumaxwebhu asemthethweni okanye itekhnoloji yemithombo yeendaba, ethe cwaka ethe cwaka.
I-GIMMPSE ibe yiMigaqo yoLawulo lokuThumela ngaphandle ye-U.S.
NgoNovemba 17, 2023, uphawula utshintsho.IMigaqo emitsha iya kuqala ukusebenza.Zibonisa amasuntswana e-chip, engqengqeleka kakhulu.Oku kuphononongwa njenge-U.S. UKUFUMANEKA KWE-U.S. UKUFUMANEKA KWE-EUV Lithography yee-chips ze-noode.Kwi-piallel, i-american giants njengemixokelelwano ye-NVidia kwi-Erivesting AI prosers kwi-China.
I-Arhente ye-U.S.Kubandakanya ukuchitha ngokugqwesa iiprosesa zokuphela kunye nokunciphisa umda ukufikelela kwizixhobo eziphambili zokuvelisa.Inqaku?Khusela ukhuseleko lukazwelonke kunye nepropathi yengqondo.Ukanti, ezi zenzo zisindisa ingxingongo ye-US-China.
Ukuhlalutya izithintelo zokuthumela ngaphandle
Incwadana yomdlalo omtsha wase-U.S.Ingathandeki.Ukuba uyilo lwe-chip lubandakanya amasuntswana amaninzi, imigaqo iqinisa.Izizwe ezikhuselekileyo ngoku zibalela ukubambisa ngokupheleleyo kuyo nayiphi na i-chip eyenziwe, itshixe abanye.
Kwii-chips ezinomdibaniso ophezulu, i-U.S..Ngaphaya koko, imigaqo yongezwa kwiisekethe ezihlanganisiweyo, iicomputer, kunye nezinto ezinamacandelo angama-50 eebhiliyoni kunye nememori yebhendi ephezulu (HBM).Banokunyanzelisa ukuthengisa kwakhona okanye iilayisensi zokuthumela ngaphandle phantsi kwendlebe.
Ukubala kwe-transfestor iba bubugcisa.Iifeksi zinokukhetha iindlela ezimbini.Iphindaphindise i-feristor yoxinaniso yindawo ye-chip okanye isebenzise izixhobo zokungqinisisa koyilo ukuqikelela ngokusekwe kwifayile ye-GDS.Le ndlela ye-nualdd ijongene nokugxila kukaRhulumente kwe-U.S.
Ukuququmbela
I-chip isurika, umqhubi kwindawo ye-semiconductor ye-semiconductor, ngoku ime kwi-Crossroads yomgaqo-nkqubo wezizwe ngezizwe kunye nengqokelela yetekhnoloji.Ulawulo olutsha lwe-U.S..Kodwa, bavuselela ngokunzulu kwimiba yobuchule benkqubo yehlabathi kunye nentsebenziswano.Oku kudityaniswa kwetekhnoloji kunye nomgaqo-nkqubo kuya kuba bubumba ikamva le-semicondcuctor.